Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11362045 | Chip package structure | Te-Hsun Lin, Chen-Tsai Yang, Kuan-Chu Wu | 2022-06-14 |
| 11251115 | Redistribution structure and forming method thereof | Chieh-Wei Feng, Tzu-Yang Ting, Tzu-Hao Yu, Chien-Hsun Chu, Jui-Wen Yang +1 more | 2022-02-15 |