Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11362045 | Chip package structure | Te-Hsun Lin, Kuan-Chu Wu, Shao-An Yan | 2022-06-14 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11362045 | Chip package structure | Te-Hsun Lin, Kuan-Chu Wu, Shao-An Yan | 2022-06-14 |