Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11413709 | High reliability lead-free solder alloys for harsh environment electronics applications | Weiping Liu | 2022-08-16 |
| 11267080 | Low temperature melting and mid temperature melting lead-free solder paste with mixed solder alloy powders | Hongwen Zhang, Fen Chen, Francis M. Mutuku, Jie Geng | 2022-03-08 |
| 11229979 | High reliability lead-free solder alloys for harsh environment electronics applications | Weiping Liu | 2022-01-25 |