Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11267080 | Low temperature melting and mid temperature melting lead-free solder paste with mixed solder alloy powders | Hongwen Zhang, Francis M. Mutuku, Jie Geng, Ning-Cheng Lee | 2022-03-08 |