Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11342261 | Integrated circuit with an interconnection system having a multilevel layer providing multilevel routing tracks and method of manufacturing the same | Stefan Cosemans, Julien Ryckaert | 2022-05-24 |
| 11270912 | Method for forming a via hole self-aligned with a metal block on a substrate | Martin O'Toole, Christopher Wilson, Ryan Ryoung-Han Kim | 2022-03-08 |
| 11264271 | Semiconductor fabrication method for producing nano-scaled electrically conductive lines | Martin O'Toole, Christopher Wilson, Stefan Decoster | 2022-03-01 |