Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11270912 | Method for forming a via hole self-aligned with a metal block on a substrate | Christopher Wilson, Zsolt Tokei, Ryan Ryoung-Han Kim | 2022-03-08 |
| 11264271 | Semiconductor fabrication method for producing nano-scaled electrically conductive lines | Zsolt Tokei, Christopher Wilson, Stefan Decoster | 2022-03-01 |