Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11295982 | Forming ultra-thin chips for flexible electronics applications | Katsuyuki Sakuma, Huan Hu | 2022-04-05 |
| 11227796 | Enhancement of iso-via reliability | Lawrence A. Clevenger, Baozhen Li, Kirk D. Peterson | 2022-01-18 |