Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11244917 | Multilayer pillar for reduced stress interconnect and method of making same | Virendra R. Jadhav, Kamalesh K. Srivastava, Brian R. Sundlof | 2022-02-08 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11244917 | Multilayer pillar for reduced stress interconnect and method of making same | Virendra R. Jadhav, Kamalesh K. Srivastava, Brian R. Sundlof | 2022-02-08 |