BS

Brian R. Sundlof

IBM: 1 patents #3,165 of 7,845Top 45%
📍 Verbank, NY: #1 of 2 inventorsTop 50%
🗺 New York: #4,032 of 12,227 inventorsTop 35%
Overall (2022): #509,146 of 548,613Top 95%
1
Patents 2022

Issued Patents 2022

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11244917 Multilayer pillar for reduced stress interconnect and method of making same Virendra R. Jadhav, Krystyna W. Semkow, Kamalesh K. Srivastava 2022-02-08