Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11476233 | Semiconductor package using a coreless signal distribution structure | Do Hyung Kim, Seung Chul Han | 2022-10-18 |
| 11422955 | Electronic device | Seung-hun Park, Seob Cho, Keon-young Seo, Nam-Jin Kim, Kwang Rae JO +2 more | 2022-08-23 |