Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11476233 | Semiconductor package using a coreless signal distribution structure | Do Hyung Kim, Jung Soo Park | 2022-10-18 |
| 11270965 | Semiconductor device with thin redistribution layers | Dong Hoon Lee, Do Hyung Kim | 2022-03-08 |