Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11489247 | Integrated circuit and terminal device | Weixi Zhou, Ming-Te Chang, Hailin Dong, Liangsheng Liu | 2022-11-01 |
| 11462817 | Packaging structure | Heng Qu, Ming Chang, Hailin Dong, Xinhong Li, Liangsheng Liu | 2022-10-04 |
| 11251136 | Flip-chip die package structure and electronic device | Wei Wu, Ding Li, Xiongcai Kuang | 2022-02-15 |