Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11251136 | Flip-chip die package structure and electronic device | Ding Li, Hongcheng Yin, Xiongcai Kuang | 2022-02-15 |
WW
Wei Wu
Overall (2022): #213,370 of 548,613Top 40%
1
Patents 2022