Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11485883 | Aqueous bonding composition | Yoshio Yoshida, Tadashi Hayakawa | 2022-11-01 |
| 11236257 | Moisture-curable hot melt adhesive | Kenji Matsuda, Ai Takamori | 2022-02-01 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11485883 | Aqueous bonding composition | Yoshio Yoshida, Tadashi Hayakawa | 2022-11-01 |
| 11236257 | Moisture-curable hot melt adhesive | Kenji Matsuda, Ai Takamori | 2022-02-01 |