Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11236257 | Moisture-curable hot melt adhesive | Kenji Matsuda, Tsuyoshi Tamogami | 2022-02-01 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11236257 | Moisture-curable hot melt adhesive | Kenji Matsuda, Tsuyoshi Tamogami | 2022-02-01 |