Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538698 | Cleave systems having spring members for cleaving a semiconductor structure and methods for cleaving such structures | — | 2022-12-27 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538698 | Cleave systems having spring members for cleaving a semiconductor structure and methods for cleaving such structures | — | 2022-12-27 |