Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515278 | Communication interface structure between processing die and memory die | Wei-Chieh Liao, Igor Elkanovich, Hung-Yi Chang, Chung-Ling Liou | 2022-11-29 |
LY
Li-Ken Yeh
Global Unichip: 1 patents #11 of 38Top 30%
Overall (2022): #358,831 of 548,613Top 70%
1
Patents 2022