Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515278 | Communication interface structure between processing die and memory die | Wei-Chieh Liao, Hung-Yi Chang, Li-Ken Yeh, Chung-Ling Liou | 2022-11-29 |
| 11474554 | Circuit for providing clock to de-serializer in communication physical layer | Ting Wang, Ting-Chin Cho, Hui-Ting Yang, Yung-Sheng Fang, Amnon Parnass +2 more | 2022-10-18 |
| 11411560 | Electronic system, integrated circuit die and operation method thereof | Pei-Ling Yu, Yung-Sheng Fang, Chang Liu | 2022-08-09 |
| 11336427 | Circuit of communication interface between two dies and method to manage communication interface | Yen-Chung Chen, Chia-Hsiang Chang, Ting-Hsu Chien, Tsai-Ming Yang, Wei-An Liang +1 more | 2022-05-17 |