Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11489241 | Transmission line having improved bending durability | Byung Hoon Jo, Da Yeon Lee, Byung Yeol Kim, Hee Seok Jung | 2022-11-01 |
| 11470018 | System-on-chip including network for debugging | Kyuseung HAN, Sukho Lee, Jae Jin Lee, Young Hwan BAE, Kyung Jin BYUN | 2022-10-11 |
| 11452200 | Flexible circuit board including bending part with improved shielding properties and manufacturing method thereof | Byung Yeol Kim, Ik Soo Kim, Hee Seok Jung | 2022-09-20 |
| 11272611 | Flexible circuit board with improved bending reliability and manufacturing method thereof | Byung Yeol Kim, Ik Soo Kim, Hee Seok Jung | 2022-03-08 |