Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11489241 | Transmission line having improved bending durability | Sang Pil Kim, Byung Hoon Jo, Da Yeon Lee, Hee Seok Jung | 2022-11-01 |
| 11452200 | Flexible circuit board including bending part with improved shielding properties and manufacturing method thereof | Sang Pil Kim, Ik Soo Kim, Hee Seok Jung | 2022-09-20 |
| 11272611 | Flexible circuit board with improved bending reliability and manufacturing method thereof | Sang Pil Kim, Ik Soo Kim, Hee Seok Jung | 2022-03-08 |