Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11270974 | Embedded copper structure for microelectronics package | Cheng Yang, Dongkai Shangguan | 2022-03-08 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11270974 | Embedded copper structure for microelectronics package | Cheng Yang, Dongkai Shangguan | 2022-03-08 |