Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11493414 | Testing system for flexible sample in electronics having a retractable holder configured to conform a sample by a mandrel | Weifeng Liu, Jesus Tan, William L. Uy | 2022-11-08 |
| 11470717 | Stress relief encapsulation for flexible hybrid electronics | Weifeng Liu, William L. Uy | 2022-10-11 |
| 11304302 | Methods of creating exposed cavities in molded electronic devices | David Geiger, Venkat Iyer, Cheng Yang | 2022-04-12 |
| 11289393 | Methods, devices, and systems for electronic device molding and encapsulation | Weifeng Liu, Jesus Tan, William L. Uy | 2022-03-29 |
| 11270974 | Embedded copper structure for microelectronics package | Cheng Yang, Li Yao | 2022-03-08 |