Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11366779 | System-in-package architecture with wireless bus interconnect | James Edward Myers, Shidhartha Das, Terrence Sui Tung Mak | 2022-06-21 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11366779 | System-in-package architecture with wireless bus interconnect | James Edward Myers, Shidhartha Das, Terrence Sui Tung Mak | 2022-06-21 |