Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11444227 | Light emitting diode package with substrate configuration having enhanced structural integrity | Tek Beng Low, Chee Sheng LIM | 2022-09-13 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11444227 | Light emitting diode package with substrate configuration having enhanced structural integrity | Tek Beng Low, Chee Sheng LIM | 2022-09-13 |