Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11444225 | Light emitting diode package having a protective coating | Tek Beng Low | 2022-09-13 |
| 11444227 | Light emitting diode package with substrate configuration having enhanced structural integrity | Tek Beng Low, Eng Wah Tan | 2022-09-13 |
| 11329206 | Lead frame and housing sub-assembly for use in a light emitting diode package and method for manufacturing the same | Tek Beng Low | 2022-05-10 |