Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527625 | Electrical performance and reliability of a semiconductor device comprising continuous diffusion structures | — | 2022-12-13 |
| 11469295 | Decoupling capacitor integrated in system on chip (SOC) device | Huahung Kao | 2022-10-11 |
| 11398431 | Through-silicon via for high-speed interconnects | — | 2022-07-26 |