Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11469295 | Decoupling capacitor integrated in system on chip (SOC) device | Runzi Chang | 2022-10-11 |
| 11282762 | Heat sink design for flip chip ball grid array | Chenglin Liu | 2022-03-22 |