Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11454949 | Auto-correlation of wafer characterization data and generation of composite wafer metrics during semiconductor device fabrication | Shivam Agarwal, Hariharasudhan Koteeswaran, Suvi Murugan, Yuan Zhong | 2022-09-27 |
| 11393118 | Metrics for asymmetric wafer shape characterization | Shivam Agarwal, Yuan Zhong, Chiou Shoei Chee | 2022-07-19 |
| 11345059 | Methods of laser machining wet cellular ceramic extrudate for honeycomb body manufacture | Ravindra Kumar Akarapu, Christopher John Malarkey, Barada Kanta Nayak | 2022-05-31 |
| 11312662 | High isostatic strength honeycomb structures and extrusion dies therefor | Thomas William Brew, Konstantin Vladimirovich Khodosevich, John M. Larson | 2022-04-26 |