HL

Hung-Wen Lin

CC Comchip Technology Co.: 2 patents #1 of 2Top 50%
📍 New Taipei, TW: #326 of 1,914 inventorsTop 20%
Overall (2022): #153,296 of 548,613Top 30%
2
Patents 2022

Issued Patents 2022

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
11302664 Method of manufacturing die package structure Chien-Chih Lai 2022-04-12
11264355 Method of manufacturing die package structure Chien-Chih Lai 2022-03-01