CL

Chien-Chih Lai

CC Comchip Technology Co.: 2 patents #1 of 2Top 50%
Overall (2022): #170,972 of 548,613Top 35%
2
Patents 2022

Issued Patents 2022

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
11302664 Method of manufacturing die package structure Hung-Wen Lin 2022-04-12
11264355 Method of manufacturing die package structure Hung-Wen Lin 2022-03-01