Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11465399 | Bonding device and bonding method | Fei Zeng, Jialin Wang, Jia Deng, Chaoxue QIN, Haitao Liang +1 more | 2022-10-11 |
| 11417233 | Systems and methods for assisting a user in practicing a musical instrument | Xiaolu Liu, Bin Yan, Gang Tong | 2022-08-16 |