Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11465399 | Bonding device and bonding method | Fei Zeng, Jialin Wang, Chaoxue QIN, Haitao Liang, Zhibing LIN +1 more | 2022-10-11 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11465399 | Bonding device and bonding method | Fei Zeng, Jialin Wang, Chaoxue QIN, Haitao Liang, Zhibing LIN +1 more | 2022-10-11 |