Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11450587 | Heat removal mechanism for stack-based electronic device with process control component and processing components | Marco Gavagnin, Gerald Weis, Gernot Grober, Young Hy Jung | 2022-09-20 |
| 11452199 | Electronic module with single or multiple components partially surrounded by a thermal decoupling gap | Martin Schrems, Steve Anderson | 2022-09-20 |
| 11388824 | Component carrier having a three dimensionally printed wiring structure | Marco Gavagnin, Jonathan Silvano de Sousa, Ferdinand Lutschounig | 2022-07-12 |
| 11277907 | Component carrier with exposed layer | Bernhard Reitmaier | 2022-03-15 |
| 11264708 | Component carrier with integrated antenna structure | Thomas Kristl, Martin Reiter, Johannes Stahr, Gernot Grober, Erich Schlaffer | 2022-03-01 |