Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11450587 | Heat removal mechanism for stack-based electronic device with process control component and processing components | Gerald Weis, Markus Leitgeb, Gernot Grober, Young Hy Jung | 2022-09-20 |
| 11430703 | Aligning component carrier structure with known-good sections and critical section with other component carrier with components and dummies | Gernot Schulz | 2022-08-30 |
| 11388824 | Component carrier having a three dimensionally printed wiring structure | Markus Leitgeb, Jonathan Silvano de Sousa, Ferdinand Lutschounig | 2022-07-12 |
| 11366181 | Component carrier with integrated flux gate sensor | Gernot Schulz, Alexander Kasper, Martin Lenzhofer, Michael Ortner | 2022-06-21 |