Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11495470 | Method of enhancing etching selectivity using a pulsed plasma | Sean S. Kang, Kenji Takeshita, Rajinder Dhindsa, Taehwan Lee, Iljo Kwak | 2022-11-08 |
| 11355543 | Packaging unit, component packaging structure and preparation method thereof | Tingze Dong, Yan Yang, Xian Li, Limin Tian | 2022-06-07 |