Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11502236 | Systems and methods for forming thin bulk junction thermoelectric devices in package | Michael J. Bishop, Gregory L. Tice, Mario J. Costello, Reid A. Black | 2022-11-15 |
| 11226459 | Integrated photonics device having integrated edge outcouplers | Michael J. Bishop, Jason Pelc, Mario J. Costello | 2022-01-18 |