Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11502236 | Systems and methods for forming thin bulk junction thermoelectric devices in package | Michael J. Bishop, Gregory L. Tice, Mario J. Costello, Vijay M. Iyer | 2022-11-15 |