YL

Yip Seng Low

AM AMD: 1 patents #317 of 950Top 35%
Overall (2022): #200,670 of 548,613Top 40%
1
Patents 2022

Issued Patents 2022

Patent #TitleCo-InventorsDate
11335659 Semiconductor chip with patterned underbump metallization and polymer film Roden R. Topacio, Suming Hu 2022-05-17