Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11335659 | Semiconductor chip with patterned underbump metallization and polymer film | Suming Hu, Yip Seng Low | 2022-05-17 |
| 11315883 | Integrated circuit product customizations for identification code visibility | Suming Hu, Farshad Ghahghahi, Jianguo Li, Andrew Kwan Wai Leung | 2022-04-26 |