Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11281280 | Reducing chiplet wakeup latency | Benjamin Tsien, Ivan Yanfeng Wang, Kevin M. Lepak, Ann Ling, Richard Martin Born +3 more | 2022-03-22 |
| 11283589 | Deskewing method for a physical layer interface on a multi-chip module | Varun Gupta, Milam Paraschou, Gerald R. Talbot, Gurunath Dollin, Damon Tohidi +6 more | 2022-03-22 |