Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11283589 | Deskewing method for a physical layer interface on a multi-chip module | Varun Gupta, Milam Paraschou, Gurunath Dollin, Damon Tohidi, Eric Ian Carpenter +6 more | 2022-03-22 |