Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11367830 | Multi-layer integrated circuit with enhanced thermal dissipation using back-end metal layers | Sundar Chetlur, Maxim Klebanov, Paolo Campiglio | 2022-06-21 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11367830 | Multi-layer integrated circuit with enhanced thermal dissipation using back-end metal layers | Sundar Chetlur, Maxim Klebanov, Paolo Campiglio | 2022-06-21 |