Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11367830 | Multi-layer integrated circuit with enhanced thermal dissipation using back-end metal layers | Sundar Chetlur, Maxim Klebanov, Yen Ting Liu | 2022-06-21 |
| 11217626 | Dual tunnel magnetoresistance (TMR) element structure | Amal Hamdache | 2022-01-04 |