Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11432406 | Package substrate | Hsing Kuo Tien, Chih-Cheng Lee, Min-Yao CHEN | 2022-08-30 |
| 11342272 | Substrate structures, and methods for forming the same and semiconductor package structures | Min-Yao CHEN | 2022-05-24 |
| 11335650 | Package substrate, electronic device package and method for manufacturing the same | Chih-Cheng Lee, Min-Yao CHEN, Hsing Kuo Tien | 2022-05-17 |
| 11239184 | Package substrate, electronic device package and method for manufacturing the same | Chih-Cheng Lee, Min-Yao CHEN, Hsing Kuo Tien | 2022-02-01 |