Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11432406 | Package substrate | Wu Chou Hsu, Hsing Kuo Tien, Chih-Cheng Lee | 2022-08-30 |
| 11342272 | Substrate structures, and methods for forming the same and semiconductor package structures | Wu Chou Hsu | 2022-05-24 |
| 11335650 | Package substrate, electronic device package and method for manufacturing the same | Wu Chou Hsu, Chih-Cheng Lee, Hsing Kuo Tien | 2022-05-17 |
| 11239184 | Package substrate, electronic device package and method for manufacturing the same | Wu Chou Hsu, Chih-Cheng Lee, Hsing Kuo Tien | 2022-02-01 |