Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11482482 | Substrate structures, methods for forming the same and semiconductor device structures comprising the same | Jin-Feng Yang, Cheng-Yu Tsai, Hung-Hsien Huang | 2022-10-25 |
| 11410902 | Semiconductor device package and method of manufacturing the same | Ming-Han Wang | 2022-08-09 |
| 11410934 | Substrate and semiconductor device package and method for manufacturing the same | Shin-Luh TARNG | 2022-08-09 |
| 11375124 | Optical measurement equipment and method for measuring warpage of a workpiece | Ming-Han Wang, Meng-Kai SHIH, Hsuan-Yu Chen | 2022-06-28 |
| 11282767 | Semiconductor package structure and electronic device | Hsin-En Chen, Jung-Che Tsai | 2022-03-22 |
| 11217502 | Semiconductor device packages and methods of manufacturing the same | Meng-Kai SHIH, Chih-Pin Hung | 2022-01-04 |