Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11227823 | Wiring structure | Tang-Yuan Chen | 2022-01-18 |
| 11217502 | Semiconductor device packages and methods of manufacturing the same | Ian HU, Meng-Kai SHIH | 2022-01-04 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11227823 | Wiring structure | Tang-Yuan Chen | 2022-01-18 |
| 11217502 | Semiconductor device packages and methods of manufacturing the same | Ian HU, Meng-Kai SHIH | 2022-01-04 |