Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527671 | Optical package structure and method of manufacturing the same | Chi-Sheng Tseng, Ching-Han Huang | 2022-12-13 |
| 11296651 | Semiconductor package structure | Chi-Sheng Tseng, Lu-Ming Lai, Ching-Han Huang, Kuo-Hua LAI, Cheng-Ling Huang | 2022-04-05 |
| 11217499 | Semiconductor package structure and method for manufacturing the same | Chi-Sheng Tseng, Lu-Ming Lai | 2022-01-04 |