Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11296651 | Semiconductor package structure | Chi-Sheng Tseng, Lu-Ming Lai, Ching-Han Huang, Hui-Chung Liu, Kuo-Hua LAI | 2022-04-05 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11296651 | Semiconductor package structure | Chi-Sheng Tseng, Lu-Ming Lai, Ching-Han Huang, Hui-Chung Liu, Kuo-Hua LAI | 2022-04-05 |