Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515249 | Wiring package and method of manufacturing the same | Chen-Chao Wang, Mi-Chun Hung | 2022-11-29 |
| 11424167 | Semiconductor package structure and method for manufacturing the same | Chen-Chao Wang, Keng-Tuan Chang | 2022-08-23 |